Critical thermal dissipation issues are threatening performance and lifetime of electronics, due to tremendous heat fluxes generated. Hence, there is a significant need for high performance heat dissipation materials to convey excessive heat away from power components and thereby reduce the working temperature of the systems.
Graphene and graphene films (GFs) are two-dimensional carbon-based nanomaterials with honeycomb lattice structures. These materials demonstrated superior thermal performance which made them potential alternative materials for thermal management. In the present work, large-area, freestanding and ultra-high thermal conductive GFs are fabricated and demonstrated as novel heat spreading and thermal interface materials.  The thermal conductivity of the graphene films can reach over 2000 W/mK along in-plane direction and the through-plane effective thermal conductivity under various pressures is also studied. We further demonstrate that our graphene films outperform Cu and Al foils and commercial graphitic sheets. This highly flexible and thermally-conductive graphene film can be easily integrated into high-power electronics and future stretchable/foldable devices and provides superior thermal management capabilities. 

Critical thermal dissipation issues are threatening performance and lifetime of electronics, due to tremendous heat fluxes generated. Hence, there is a significant need for high performance heat dissipation materials to convey excessive heat away from power components and thereby reduce the working temperature of the systems.
Graphene and graphene films (GFs) are two-dimensional carbon-based nanomaterials with honeycomb lattice structures. These materials demonstrated superior thermal performance which made them potential alternative materials for thermal management. In the present work, large-area, freestanding and ultra-high thermal conductive GFs are fabricated and demonstrated as novel heat spreading and thermal interface materials.  The thermal conductivity of the graphene films can reach over 2000 W/mK along in-plane direction and the through-plane effective thermal conductivity under various pressures is also studied. We further demonstrate that our graphene films outperform Cu and Al foils and commercial graphitic sheets. This highly flexible and thermally-conductive graphene film can be easily integrated into high-power electronics and future stretchable/foldable devices and provides superior thermal management capabilities.