Hexagonal boron nitride (h-BN), a two-dimensional (2D) layered material, can be stable at 1500oC in air and will not react with most of chemicals. Several applications have been proposed for this material including its use as a smooth substrate for graphene devices, as barrier layers for vertical hybrid atomic layer stacks with a few graphene and h-BN layers. In this talk, we first demonstrate synthesis of large-scale ultrathin coatings of high quality h-BN layers with controlled thicknesses from double layers to bulk. We show that such ultrathin h-BN films are impervious to oxygen diffusion even at high temperatures and can serve as high-performance oxidation resistant coatings for nickel up to 1100oC in oxidizing atmospheres. Next, large area continuous h-BN film grown on nickel foil by CVD method was then transferred onto sputtered copper as a corrosion passivation coating. The corrosion passivation performance in Na2SO4 solution of bare and coated copper was investigated by electrochemical methods including cyclic voltammetry (CV), Tafel polarization and electrochemical impedance spectroscopy (EIS). CV and Tafel analysis indicate that h-BN coating could effectively suppress the anodic dissolution of copper. EIS fitting result suggests that defects are the dominant leakage source on h-BN film and improved anti-corrosion performances could be achieved by further passivating those defects.

Hexagonal boron nitride (h-BN), a two-dimensional (2D) layered material, can be stable at 1500oC in air and will not react with most of chemicals. Several applications have been proposed for this material including its use as a smooth substrate for graphene devices, as barrier layers for vertical hybrid atomic layer stacks with a few graphene and h-BN layers. In this talk, we first demonstrate synthesis of large-scale ultrathin coatings of high quality h-BN layers with controlled thicknesses from double layers to bulk. We show that such ultrathin h-BN films are impervious to oxygen diffusion even at high temperatures and can serve as high-performance oxidation resistant coatings for nickel up to 1100oC in oxidizing atmospheres. Next, large area continuous h-BN film grown on nickel foil by CVD method was then transferred onto sputtered copper as a corrosion passivation coating. The corrosion passivation performance in Na2SO4 solution of bare and coated copper was investigated by electrochemical methods including cyclic voltammetry (CV), Tafel polarization and electrochemical impedance spectroscopy (EIS). CV and Tafel analysis indicate that h-BN coating could effectively suppress the anodic dissolution of copper. EIS fitting result suggests that defects are the dominant leakage source on h-BN film and improved anti-corrosion performances could be achieved by further passivating those defects.